first level inc. - Technology Based Contract Manufacturing Facility in York, PA
First Level Inc, first level microelectronics packaging, electronics assembler, assembly electronics, contract electronics manufacturing, electronic pcb assembly, led lighting assembly, electronic manufacturing services, micro electronics, tqfp package, die bonding, wire bonding, wire bond, York, Pennsylvania, chip packages, surface mount, gold wire bonding, aluminum wire bonding, circuit board assembly
first level inc. is a technology based contract assembly facility specializing in first level microelectronics packaging. The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly. Expert engineers and highly skilled technicians provide design, process, and manufacturing services.